A Sample of Recent Scientific Articles
Publications
J. Zhang, Zhou Hai, S. Thirugnanasambandam, J. L. Evans, M. J. Bozack, Y. Zhang, and J.
C. Suhling, “The Impact of Isothermal Aging on the Reliability of Lead Free Solder Joints,”
(submitted, 2012 Surface Mount Technology Association Conference).

R. Fu, S-Y Cloe, R. L. Jackson, G. T. Flowers, M. J. Bozack, L. Zhong, D. Kim, “Vibration-
Induced Changes in the Contact Resistance of High Power Electrical Connectors for
Hybrid Vehicles,” IEEE Comp. Pack. Manuf. Technol. 2 (2012) 185-193.

E. R. Crandall, G. T. Flowers, P. Lall, and M. J. Bozack, “Influence of Surface Oxides on
Whiskering,” Proc. 58th Int’l IEEE Holm Conference on Electrical Contacts, 2012,  http://dx.
doi.org/10.1109/HOLM.2012.6336581.

E. R. Crandall, G. T. Flowers, P. Lall, and M. J. Bozack, “Whisker Prevention Using Hard
Metal Cap Layers,” Proc. 58th Int’l IEEE Holm Conference on Electrical Contacts, 2012,
http://dx.doi.org/10.1109/HOLM.2012.6336596.

M. J. Bozack, J. C. Suhling, Y. Zhang, Z. Cai, and P. Lall, “Surfaces of Mixed Formulation
Solder Alloys at Melting” J. Vac. Sci. Technol. A29 (2011) 041401.

M. J. Bozack, J. C. Suhling, Y. Zhang, Z. Cai, and P. Lall, “Influence of Surface Segregation
on Wetting of SAC (Sn-Ag-Cu) Series Solder Alloys” J. Elect. Mat.  40 (2011) 2093-2104.

Z. Cai, M. Mustafa, J. C. Suhling, P. Lall, and M. J. Bozack, “The Effects of Dopants on the
Aging Behavior of Lead Free Solders,” Proc. ASME  InterPACK Conference, Portland, OR,
July 6-8, 2011.

E. R. Crandall, G. T. Flowers, R. Jackson, P. Lall, and M. J. Bozack, “Growth of Sn
Whiskers Under Net Compressive and Tensile Stress States,” 2011 Proc. 57th IEEE
Holm Conference on Electrical Contacts, Minneapolis, MN, Oct 2011, 10.1109/HOLM.
2011.6034820.

S. Alur, R. Thapa, T. Gnaprakasa, Y. Wang, Y. Sharma, E. Javalose, E. Smith, C. Ahyi, A.
Simonian, M. J. Bozack, J. R. Williams, and M. Park, “DNA Hybridization Sensor Based on
AlGaN/GaN HEMT,” Phys. Status Solidi C (2011) 1-3/DOI 10.1002/pssc.201001164.

C. L. Rodekohr, G. T. Flowers, M. J. Bozack, R. Matins, Z. Zhao, E. R. Crandall, V. Starman,
T. Bitner, and J. Street, “Correlation of Intrinsic Thin Film Stress Evolution with Whisker
Growth” 2011 Proc. 57th IEEE Holm Conference on Electrical Contacts, Minneapolis, MN,
Oct 2011; DOI 10.1109/HOLM.2011.6034804.

(BEST PAPER OF CONFERENCE AWARD) E. R. Crandall, G. T. Flowers, P. Lall, and M. J.
Bozack, “Whisker Growth Under Controlled Humidity Exposure,” 2011 Proc. 57th IEEE
Holm Conference on Electrical Contacts, Minneapolis, MN, Oct 2011, 10.1109/HOLM.
2011.6034780.

C. Horikawa, S. H. Bedi, I. Chen, M. Auad, M. J. Bozack, J. Barbaree, V. Petrekno, and B.
Chin, “Effects of Surface Phage Coverage on the Performance of Wireless Phage-
Immobilized Magnetoelastic Biosensors,” J. Biosensors and Bioelectronics 26 (2011)
2361-2367.

M. J. Bozack, C. L. Rodekohr, G. N. Flowers, and J. C. Suhling, “High-Resolution Auger
Electron Spectroscopic (AES) Measurements on High-Aspect Ratio Sn Whiskers on
Brass” IEEE Trans. Components and Packaging Technologies 33 (2010) 198-204.

Y. Zhang, Z. Cai, M. Mustafa, J. C. Suhling, P. Lall, and M. J. Bozack, “The Influence of
Aging on the Stress-Strain and Creep Behavior of SAC Solder Alloys,” 2010 12TH IEEE
Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems
(ITherm 2010), Las Vegas, NV, June 2-5, 2010, 10.1109/ITHERM.2010.5501301.

(BEST PAPER OF CONFERENCE AWARD) Z. Cai, Y. Zhang, J. C. Suhling, P. Lall, R. W.
Johnson, and M. J. Bozack, “Reduction of Lead-Free Solder Aging Effects Using Doped
SAC Alloys,” Proc. 60th Electronic Components and Technology Conference (ECTC), Las
Vegas, NV, June 2-5, 2010, p. 1493-1511, 10.1109/ECTC.2010.5490796.

S. H. Bedi, I. Chen, M. Auad, M. J. Bozack, J. Barbaree, V. Petrekno, and B. Chin, “Surface-
Functionalized Magnetoelastic Resonators Interfaced with a Landscape Phage Layer for
Wireless Biosensing Applications,” 218th Annual Electrochemical Society (ECS) Meeting,
Las Vegas, NV, Oct 10-15, 2010.

C. L. Rodekohr, G. T. Flowers, J. C. Suhling, D. A. Rodekohr, and M. J. Bozack, “The Effects
of Surface Finish Roughness on Intermetallic Layer Growth, Intermetallic Interface
Roughness, and Solder Joint Reliability,” 2010 Proc. 56th IEEE Holm Conference on
Electrical Contacts, Charleston, SC, Oct 2010, 10.1109/HOLM.2010.5619460.